THE INVENTION
Nanotwinning-assisted structurally stable and metastable copper for advanced electronic packaging applications
C: Electronics – Electricity – Methods of communication – Electrical network
THE INVENTION
- Name of invention
- Nanotwinning-assisted structurally stable and metastable copper for advanced electronic packaging applications
- Cuivre stable structurellement et métastable assisté par nano-jumelage pour des applications avancées d'emballage électronique
Invention description
- Description
- Stable nanograin copper structures with doped nanotwins for low-temperature bonding for enhancing 3D integrated circuit redistribution layer stacking efficiency.
- Video
- Link
INVENTORS
CITY UNIVERSITY OF HONG KONG
inventor 354288236_244
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