THE INVENTION
Thermomigration creep for enhanced Cu–Cu direct bonding
C: Electronics – Electricity – Methods of communication – Electrical network
THE INVENTION
- Name of invention
- Thermomigration creep for enhanced Cu–Cu direct bonding
- Fluage de thermomigration pour une liaison directe Cu-Cu améliorée
Invention description
- Description
- Controlled heat-induced migration enhances microelectronic copper-to-copper connections, improving device performance and reliability.
INVENTORS
CITY UNIVERSITY OF HONG KONG
inventor 354288206_244
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