THE INVENTION

THE INVENTION
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Low dielectric polyimide material for high frequency communication

D: Building – Architecture – Civil Engineering – Construction – Materials – Woodworks

THE INVENTION

Name of invention
Low dielectric polyimide material for high frequency communication

Matériau polyimide à faible diélectrique pour les communications à haute fréquence

Invention description

Description
Reducing the dipole vector and chemical polarity of monomers, obtained the low-dielectric loss polyimides (0.0017@40 GHz).The products can be applied to FCCL.

INVENTORS

NANJING UNIVERSITY
NANJING UNIVERSITY
inventor 3609292018_2356

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