THE INVENTION
Ice transfer for 2D materials and ultra-clean semiconductor device manufacture
W: Hardware – Software – Cybersecurity – Blockchain – Internet of things (IoT)
THE INVENTION
- Name of invention
- Ice transfer for 2D materials and ultra-clean semiconductor device manufacture
- Transfert de glace pour la fabrication de matériaux 2D et de dispositifs semi-conducteurs ultra-propres
Invention description
- Description
- Method to use water ice to transfer 2D semiconductor components from growth substrates to target substrates with better cleanliness and performance than conventional methods.
INVENTORS
CITY UNIVERSITY OF HONG KONG
inventor 354288220_244
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